In his keynote presentation at BITS, entitled “Packaging & Assembly in Pursuit of Moore’s Law and Beyond,” Karl Johnson Ph.D., V.P., and senior fellow at the advanced packaging systems integration laboratory, Freescale Semiconductor, will address new challenges, trends in packaging and assembly, and some unique solutions, including system-on-chip, 3D, system-in-package and wafer-level assembly. Additionally, invited speaker, Belgacem Haba, Ph.D., Fellow and CTO of advanced packaging and interconnect, Tessera Inc., will discuss different alternatives available for 3D packaging as well as new ideas that people are planning for the mobile phone revolution to continue in his presentation titled “Catching the Mobile Wave: Packaging is Going 3D.”
The model DB-6100 stand-alone break processor speeds up sapphire wafer separation. Increasing quantities and continuous price pressure, resulting in cost reduction programs, is driving the die size of photonics components, especially LEDs, further down. Efficient die separation with very small compound semiconductor devices is becoming therefore more of an issue. The advanced design of this break module can break dies as small as 200 x 200µm, even if relatively thick in relation to their size. To extend this capability to laser pre-scribed sapphire wafers of high bright LEDs, the break module has been substantially enhanced in force and cycle time to break the stronger material and to increase the throughput. The new semi-automated breaker model DB-6100 will also be available as a fully automated solution, including cassette-to-cassette wafer handling. DynTest Technologies GmbH, Grassau, Germany; www.dyntest.de.