New tool set adds NIL capability to SUSS mask aligners

March 7, 2008 — SUSS MicroTec, toolmaker for MEMS, 3D/nano semiconductor, and advanced packaging development and manufacturing, has launched an “advanced nanotechnology” tool set for its mask aligners. The new nanoimprint lithography (NIL) tool enables SUSS aligners to print resist thicknesses from less than 100 nanometers to a few hundred microns with a printing resolution down to a few nanometers.

SUSS explains that UV-NIL, a low-cost production technology based on UV-curing, has been developed as a cost-effective alternative to high-resolution e-beam lithography to print sub-20 nanometer geometries. UV-NIL applications with promising prospects include semiconductor, MOEMS, MEMS/NEMS and optoelectronic technologies.

“This toolset can be upgraded on any previously installed SUSS MA6 mask aligner with very limited effort,” the company says.

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