Needle and spring probes require the device manufacturer to design large IC pads to accommodate a large scrub area. The P30’s patented Microscrub creates a smaller scrub mark, reducing the material displacement by 15 times, causing a reduction in particles created during wafer testing. Needle probes also need regular realignment, resulting in down-time during production testing. The P30 Pyramid probes do not require re-alignment.
TC-20SAS, a thermally conductive silicone double-sided adhesive tape is from Shin-Etsu Chemical Co., Ltd. provides thermal resistance and electrical insulation properties in addition to its thermal conductivity of 0.7 W/m·K and its adhesiveness. The thickness of this new silicone adhesive tape is 200µm and its standard size is 300mm x 400mm. Thus, it can respond to desired size. Mass-production of the tape is scheduled for June 2008.