(May 7, 2008) Burlingame, CA — When the IEEE International Interconnect Technology Conference convenes at the Hyatt Regency San Francisco Airport Hotel, Burlingame, CA, June 1-4, the focus will be squarely on 3D technologies. Attendees will have the opportunity to gain both fundamental knowledge and practical manufacturing advice from 3D experts at chip companies and universities from around the world.
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