Angstron acquires manufacturing facility for carbon nano-graphene platelets

June 9, 2008 — Advanced nanomaterials company Angstron Materials LLC has acquired a new 22,000 square foot manufacturing facility where it will provide small to large batch processing and production capacity for its carbon-based nano-graphene platelets (NGPs), and continue its research and development efforts. Angstron’s NGPs can be blended with other nanomaterials to achieve higher loadings required for various forms of composite lamina as well as nanocomposites for load-bearing and functional applications.

Based in Dayton, Ohio, the new facility will increase Angstron’s ability to offer customers a turnkey solution from application development and pilot quantities for test articles to scale-up for required production volumes. The company claims that NGPs can be used as an alternative to carbon nanotubes and are suited to aerospace, automotive, energy, marine, electronics, construction, medical and telecommunications applications.
Angston announced availability of large quantities of its single atomic layer thick NGPs in April, 2008.

“The new location gives Angstron the capability to produce tons of pristine NGP material annually,” said Dr. Bor Z. Jang, CEO of Angstron Materials, LLC. “The larger facility will allow Angstron to more effectively meet customer requirements.”

Angstron’s engineered NPGs are available in several forms including raw materials and solutions. These solutions can achieve an exceptionally high loading and maintain uniform dispersion without degrading viscosity.
The company promises to reduce production cost barriers with its nano-graphene solutions, and claims that NGPs are similar to nanotubes but offer improved performance properties including very high Young’s modulus, strength and surface area, superior thermal and electrical conductivity, lower density and less weight. As a result, Angstron says it is able to work with companies to develop products for batteries, fuel cells, supercapacitors, light weight structural components as well as electromagnetic interference (EMI), radio frequency interference (RFI), electrostatic discharge (ESD), lightning strike and composite applications.

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