Spansion broadening outsourcing plans, narrowing focus on MirrorBit flash memory

June 19, 2008 – Spansion says it is extending its plan to hand off manufacturing and technology work to external partners, continuing a “flexible manufacturing strategy” begun nearly two years ago with the sale of two Japanese fabs, in order to focus its capital investments on accelerating development of leading-edge MirrorBit flash memory technology, other “value-added, high-margin solutions,” and its newest SP1 300mm flash memory fab in Aizu-Wakamatsu, Japan.

According to a statement, Spansion plans to continue partnering with foundries to produce high-volume commodity products, handing over both new technology development and mature/trailing-edge wafer manufacturing. It also is offloading some manufacturing test/assembly assets to third parties, in order to maintain service/support “at a competitive cost.”

“The plan to partner through strategic alliances is a deliberate program to focus investments and resources on strategic, differentiated and value- added business opportunities,” said Bertrand Cambou, CEO of Spansion. “At the same time, we can focus our investments and support the right mix of assets to maintain and increase our competitive advantage.”

The increased reliance on partners’ manufacturing capabilities comes just weeks after Spansion said it reduced outsourced work by ~$50M in 1Q08 vs. a year ago, citing higher-than-expected manufacturing efficiencies out of its Fab 25 (Austin, TX) and SP1 (Aizu-Wakamatsu, Japan) facilities.

In September 2006 Spansion sold its JV1 and JV2 facilities in Japan to Fujitsu for $150M; the sites are adjacent to Fujitsu’s Aizu-Wakamatsu fab in northeastern Japan.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...