Mask Aligner for 3D Packaging

The second-generation SUSS MA300, from SUSS MicroTec is a highly automated mask aligner platform for 300-mm and 200-mm wafers. Specifically designed for 3D packaging, it features a dedicated alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging. It also targets wafer bumping and wafer level packaging (WLP) applications, but can be used for other technologies where geometries in the range of 5 and 100 &#181m must be exposed.

In addition to the standard topside alignment with accuracies down to 0.5 &#181m a 3D-alignment platform enables bottom side and infrared alignment for 300-mm based 3D packaging lithography applications such as etch masks for TSVs and dicing streets, backside redistribution layers (RDLs), or bumping applications. Bottom-side alignment enables processing of double-sided structured wafers, while infrared alignment option allows for handling of opaque, yet IR-transparent materials such as adhesives, particularly for thin wafer handling or encapsulation applications.

Unlike steppers proximity mask aligners are very efficient when exposing very thick layers. Mask aligners offer large process windows because they don’t have the depth of focus limitations known from projection systems. SUSS MicroTec Lithography GmbH, Munich, Germany. www.suss.com

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