MEPTEC and Advanced Packaging Magazine to Hold Packaging Symposium

(AUGUST 12, 2008) SAN JOSE, CA &#151 In recognition of MEPTEC’s 30th year, MEPTEC and Advanced Packaging magazine will present Packaging Developments and Innovations: From System Design to Integrated Delivery, Thursday, November 13, 2008, at the Wyndham Hotel in San Jose, CA. The symposium will include a special luncheon featuring keynote speaker, Glenn Daves, director of packaging technology, Freescale Semiconductor.

Since its inception in 1978, MEPTEC has set out to inform and set industry standards to help drive the back-end assembly and test infrastructure. What began as a small selection of package types to select from has grown to incorporate over 100 different types designed to achieve density, performance, and cost goals to ensure end-product solutions. This symposium was organized with the intention of building on that tradition.

Are packages necessary if we have new wafer-level inner-to-outer-connects? Are substrates soon to be replaced with solder-less build-up networks? Why not just continuously embed silicon and integrate subsystems? What are the other interconnect challenges so we can go from 3D to 4D? These questions were the original motivation and concept for initiating this symposium. The variety of topics covered display some of the novel and innovative approaches toward solving and answering interconnect, packaging, process assembly, and end-product challenges.

Lead by such industry experts as Jim Walker, principal analyst for Gartner Dataquest, and Advanced Packaging magazine advisory board member; Gail Flower, editor-in chief, Advanced Packaging; Mary Ollson, Gary Smith EDA; and Dale Baird, of Sierra Microelectronics; sessions will include Advanced Packages and Processes, Packaging to Board Assembly Trends, Design Tools and Co-Design Solutions, and Microelectronics Substrate Fabrication and Assembly Innovations. For full synopses, visit


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