EMC3D Consortium Achieves Cost Goal for TSV

SANTA CLARA, CA — Two years ago, the EMC3D Consortium, an open consortia of equipment and materials manufacturers, established itself and set out to develop a process flow and cost model for 3D integration. Focusing on via-first TSVs as the method of interconnect, the intention was to find a solution to achieving this for $200/wafer cost of ownership (CoO) on a 3-year timeline. It appears, however, that they’ve beaten their own goal ahead of schedule, according to the Sept. 4th announcement that a proprietary process flow, iTSV, is achievable at $189/wafer for a 10,000 wafers/month capacity line.

The key, according to Rozalia Beica, program manager of EMC3D and TSV director for Semitool, is via-first chip stacking technology using 5

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...