EMC3D Consortium Achieves Cost Goal for TSV

SANTA CLARA, CA — Two years ago, the EMC3D Consortium, an open consortia of equipment and materials manufacturers, established itself and set out to develop a process flow and cost model for 3D integration. Focusing on via-first TSVs as the method of interconnect, the intention was to find a solution to achieving this for $200/wafer cost of ownership (CoO) on a 3-year timeline. It appears, however, that they’ve beaten their own goal ahead of schedule, according to the Sept. 4th announcement that a proprietary process flow, iTSV, is achievable at $189/wafer for a 10,000 wafers/month capacity line.

The key, according to Rozalia Beica, program manager of EMC3D and TSV director for Semitool, is via-first chip stacking technology using 5

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