EMC3D Consortium Achieves Cost Goal for TSV

SANTA CLARA, CA — Two years ago, the EMC3D Consortium, an open consortia of equipment and materials manufacturers, established itself and set out to develop a process flow and cost model for 3D integration. Focusing on via-first TSVs as the method of interconnect, the intention was to find a solution to achieving this for $200/wafer cost of ownership (CoO) on a 3-year timeline. It appears, however, that they’ve beaten their own goal ahead of schedule, according to the Sept. 4th announcement that a proprietary process flow, iTSV, is achievable at $189/wafer for a 10,000 wafers/month capacity line.

The key, according to Rozalia Beica, program manager of EMC3D and TSV director for Semitool, is via-first chip stacking technology using 5

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Compact point of use fluid delivery heater replaces multiple components in a system
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater...
New fiber optic temperature sensing and control system ideal for RF environments
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announced its new EZ-ZONE RM fiber optic temperature me...