SUSS adds large area nanoimprint litho to mask aligners

October 7, 2008: SUSS MicroTec, a supplier of solutions for the 3D, MEMS, advanced packaging and nanotechnology markets, announced that the capabilities of its manual mask aligners are now enhanced with a new nanoimprint toolkit that enables them to pattern large areas with repeatable sub-50nm printing capability.

The new technology, called substrate conformal imprint lithography (SCIL), has been developed by Philips Research, Eindhoven/The Netherlands and transferred to SUSS MicroTec in a technology license agreement.

SCIL is bridging the gap between small rigid stamp nano imprint lithography (NIL) application for best resolution and large-area soft stamp usage with usually limited printing resolution below 200nm. Its excellent performance in terms of substrate conformity and pattern fidelity over large areas makes this imprint technology a powerful tool, especially for applications such as high brightness LEDs, high-efficient laser diodes or BPM (bit patterned media) to use in next-generation hard disc drives.

The SCIL toolkit can be field-installed on any SUSS MA6/8 mask aligner.

a)

b)

a) SUSS MicroTec Logo printed in Amonil MMS 4 on a SUSS MA6 Mask Aligner. b) Section of U-letter with holes 160nm.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...