Self-filleting Die-attach Technology

Ablestik self-filleting die attach products from Henkel incorporate a self-filleting mechanism to create a cost-effective alternative to die-attach films. Until recently, die-attach films were the only option to achieve bonding thicknesses down to 5&#181m. However, self-filleting die-attach pastes accomplish this without requiring changes to current equipment sets or process steps at a reportedly reduced cost-of-use than die-attach film.

While conventional die attach pastes can be hard to control when trying to meet package requirements of thinner die with tighter tolerances, this novel technology uses capillary force to control flow and deliver complete wetting. Instead of complicated, precise dispense patterns combined with die placement force to encourage flow, determine bondline thickness, and promote wetting, these self-filleting pastes use capillary function to control these critical process parameters through dispense volume and spacer technology.

Using traditional automatic dispense technology, material is deposited and the die gently placed. The material’s capillary force draws it out to the edge of the die where it forms a small fillet. No excessive placement force is required, which eliminates die damage while also allowing for extremely tight process control. The materials are available in three formulations: non-conductive paste for die-to-substrate laminate-based devices; non-conductive material for die-to-die attachment, including same size, pyramidal and orthogonal die stack packages; and conductive adhesive designed for die-to-substrate leadframe packages. Henkel Corp. Irvine, CA; www.henkel.com/electronics.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...