(January 13, 2009) SAINT JEOIRE, France Smart Equipment Technology (S.E.T.), a wholly-owned subsidiary of Replisaurus Technologies, announced a collaboration with IMEC to develop die pick-and-place and bonding processes for 3D chip integration using S.E.T.’s flip chip bonder equipment. As part of the collaboration, S.E.T. will join IMEC’s Industrial Affiliation Program (IIAP) on 3D integration.
IMEC’s 3D integration program explores 3D technology and design for applications in various domains, focusing on 3D wafer-level packaging and 3D stacked-ICs, to find cost-effective uses for 3D interconnects. The joint development program will use the S.E.T. FC300, a high-accuracy (=0.5µm), high force (4,000N) device bonder system for D2D and D2W bonding on wafers up to 300mm. The parties will collaborate to develop highly-accurate pick-and-place and low-temperature bonding processes, which are required by advanced 3D integration schemes. The program is scheduled to begin during the first quarter of ’09.
Luc van den Hove, executive V.P. and COO of IMEC, says both Replisaurus and S.E.T. technologies are interesting for advanced packaging applications, and that S.E.T.’s FC300 device bonder system will help complete IMEC’s program.”The integration of the FC300 will be a welcome addition to our 3D program, as is the participation of S.E.T. and Replisaurus,” said van den Hove.
The FC300 is complimentary to electrochemical pattern replication (ECPR) technology, which is well-suited for advanced 3D integration and related applications, notes James Quinn, CEO of Replisaurus. “IMEC’s installation of the FC300 is fully in line with Replisaurus’ product and technology portfolio, which offers game-changing opportunities to the global chip market,” he said.