Package on Package

Amkor’s TMVPoP is a next-generation package-on-package (PoP) that incorporates the company’s proprietary through mold via (TMV) technology, which uses lasers to create interconnect vias through the mold cap. TMV technology reportedly provides a stable bottom package that enables use of thinner substrates with a larger die to package ratio. TMV enabled PoP can support single, stacked die or FC designs, and is ideal for the emerging 0.4mm pitch low-power DDR2 memory interface requirements. Additionally, it enables the stacked interface to scale with solder ball pitch densities to 0.3mm pitch or below.

Benefits of TMVPoP includes improved integration capability, reduced package warpage, and increased performance. Additionally, TMV technology is said to enables next-generation PoP requirements by removing bottlenecks for fine-pitch memory interfaces, enhance warpage control and bottom package thickness, increase die-to-package size ratio, and support wire bond, flip chip, and stacked die processes. Amkor Technology, Chandler, AZ, www.amkor.com

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