Package on Package

Amkor’s TMVPoP is a next-generation package-on-package (PoP) that incorporates the company’s proprietary through mold via (TMV) technology, which uses lasers to create interconnect vias through the mold cap. TMV technology reportedly provides a stable bottom package that enables use of thinner substrates with a larger die to package ratio. TMV enabled PoP can support single, stacked die or FC designs, and is ideal for the emerging 0.4mm pitch low-power DDR2 memory interface requirements. Additionally, it enables the stacked interface to scale with solder ball pitch densities to 0.3mm pitch or below.

Benefits of TMVPoP includes improved integration capability, reduced package warpage, and increased performance. Additionally, TMV technology is said to enables next-generation PoP requirements by removing bottlenecks for fine-pitch memory interfaces, enhance warpage control and bottom package thickness, increase die-to-package size ratio, and support wire bond, flip chip, and stacked die processes. Amkor Technology, Chandler, AZ, www.amkor.com

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...
Versatile high throughput SEM from JEOL
11/04/2015JEOL's new JSM-IT100 is the latest addition to its InTouchScope Series of Scanning Electron Microscopes....