(July 22, 2009) MINNEAPOLIS — The SMTA and Chip Scale Review magazine finalized the program for the 6th Annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 27-30, 2009, at the Santa Clara Marriott Hotel in Santa Clara, CA. Registration is now being processed on-line.
The program includes five tutorials, expert panel discussions, distinguished keynote speaker, Advanced Packaging Editorial Advisory Board member Dr. Rao Tummala, and 18 tech sessions featuring a new track on MEMS WL and WLP.
IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The event is sponsored by Dow Electronic Materials, Pac Tech USA, and Technic Inc. Read about last year’s IWLPC, with commentary from Terence Q. Collier, contributing editor.
For more information, visit www.iwlpc.com.