Prelim numbers: “Record” growth for Intersolar NA, SEMICON West slower

July 21, 2009 – Preliminary numbers are in from last week’s Intersolar North America, where the show more than doubled its exhibition participation and “exceed[ed] organizers expectations for the second straight year,” according to a statement put out by group.

More than 560 total solar exhibitors presented at both Intersolar and the co-located SEMICON West, with 444 solely on the Intersolar side up from 210 a year ago, a 111% increase, the group noted. Combined, the two events hosted ~17,000 visitors, roughly the same as in 2008; the Intersolar NA conference, with 170 speakers in 25 tracks, attracted >2000 visitors. (SEMI’s own preliminary numbers, released during its market analysis update on Tuesday afternoon, indicated a +4% increase in preregistrations across both events, with SEMICON West-only exhibitors numbering ~695, down about 23% from 2008.

“The US solar market has incredible potential, and with the support of industry associations, including the SEMI PV Group, ASES and CALSEIA, we are creating an opportunity for solar professionals to come together and discuss continued development for the US market,” said Markus Elsaesser, CEO of exhibition and conference organizer Solar Promotion International GmbH, in a statement.

Videos and photos showcasing Intersolar NA can be found at the group’s Web site.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...