SUSS, Thin Materials Cooperate on Temporary Bonding for 3D Packaging

(July 8, 2009) GARCHING and MUNICH, Germany &#151 SUSS MicroTec and Thin Materials, a semiconductor process development company, are cooperating on a temporary bonding solution to be used for challenging thin wafer handling technologies required for emerging 3D integration and packaging technologies. With this cooperation SUSS MicroTec extends its solution portfolio for temporary bonding and thin wafer handling.

The temporary bond material of Thin Materials is capable of handling wafer processing temperatures in excess of 250&#176C while being able to do a room temperature de-bond. This simplifies the debond process by eliminating a number of steps thus saving time and lowering device costs. The Thin Materials process runs on SUSS MicroTec’s production wafer bonder, XBC300, whose modularity and high process flexibility can easily be adapted for changing environments and processed material. The XBC300 temporary bond configurations are available for development and high volume needs.

“We have been working closely with SUSS MicroTec as one of the leading experts for 3D integration solutions,” states Franz Richter, Ph.D., CEO of Thin Materials AG, “We are looking forward to extending this partnership and jointly supply our customers with cutting-edge solutions.”

“Thin Materials’ technology for temporary bonding complements our process offering portfolio for 3D Integration and Packaging,” confirms Frank Averdung, president and CEO of SUSS MicroTec “Partnering with Thin Materials allows us to offer our customers a wide variety of temporary bonding technologies according to their specific needs.”

Together with its partners 3M, Disco, DuPont, NEXX Systems, Surface Technology Systems, and Thin Materials, SUSS MicroTec will host a TSV 3D Integration workshop introducing solutions for temporary bonding and thin wafer handling on July 15th during SEMICON West, San Francisco, CA. For more information, visit www.suss.com/company/events/thin_wafer_processing_workshop_2009.

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