Behind Brewer Science’s wafer bonding work

Karen Twillmann, executive director of corporate marketing at Brewer Science, discusses the advances made by the company’s temporary bond adhesive for wafer bond applications:

Dan Wallace, director of 3D packaging at the company, told SST that it is in numerous development projects with end users. “At the same time we’re committed to the continuous improvement and introduction of 3D packaging solutions for the industry,” said Wallace. He noted that the company is focused on three key areas of focus relative to equipment, material and process, as related to temporary waferbond.

The current temporary adhesive, HT10.10, is rated at a 220°C maximum temperature tolerance, said Wallace. “Although in certain applications it can be exposed to much higher temperatures, conservatively we rate it at 220°C.” Recognizing that there is a need for adhesives that can withstand higher temperatures, the company is also engaged in development activity and is in the process to introduce materials capable of up to 300°C by the first quarter of 2010.

In a second area of focus, the company be will be introducing an R&D level high-temp slide debonder to support users who are not ready to invest in production-level equipment. “This will allow the flexibility to perform R&D activity in a confidential setting,” Wallace told SST. The Cee 1300DB has a planned introduction of December 2009 and information is available now.

A third area of focus is applications with solder bumps that require higher temperature tolerant adhesives >220°C. These materials will not tolerate the existing high temperature slide debond process. “We’re in proof of concept developing a patented room-temperature debond process combining the benefits of the thermoplastic adhesive while removing the need to debond at high temperature,” Wallace told SST. Alpha phase is targeted for 2Q10; “we are working with our partner EVG regarding automated equipment design and manufacture,” he said.

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Behind Brewer Science’s wafer bonding work

Karen Twillmann, executive director, corporate marketing, at Brewer Science, discusses the advances made by the company’s temporary bond adhesive for wafer bond applications:

Dan Wallace, director of 3D packaging at the company, told AP that it is in numerous development projects with end users. “At the same time we’re committed to the continuous improvement and introduction of 3D packaging solutions for the industry,” said Wallace. He noted that the company is focused on three key areas of focus relative to equipment, material and process, as related to temporary waferbond.

The current temporary adhesive, HT10.10, is rated at a 220°C maximum temperature tolerance, said Wallace. “Although in certain applications it can be exposed to much higher temperatures, conservatively we rate it at 220°C.” Recognizing that there is a need for adhesives that can withstand higher temperatures, the company is also engaged in development activity and is in the process to introduce materials capable of up to 300°C by the first quarter of 2010.

In a second area of focus, the company be will be introducing an R&D level high-temp slide debonder to support users who are not ready to invest in production-level equipment. “This will allow the flexibility to perform R&D activity in a confidential setting,” Wallace told AP. The Cee 1300DB has a planned introduction of December 2009 and information is available now.

A third area of focus is applications with solder bumps that require higher temperature tolerant adhesives >220°C. These materials will not tolerate the existing high temperature slide debond process. “We’re in proof of concept developing a patented room-temperature debond process combining the benefits of the thermoplastic adhesive while removing the need to debond at high temperature,” Wallace told AP. Alpha phase is targeted for 2Q10; “we are working with our partner EVG regarding automated equipment design and manufacture,” he said.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

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You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...