siXis partners with SVTC to commercialize silicon circuit boards

August 24, 2009 — SVTC Technologies was chosen by technology startup siXis, Inc. to supply silicon manufacturing services for their compact, high-speed embedded computing modules that bridge the gap between programmable devices and costly, customized semiconductors.

The siXis modules utilize a unique silicon circuit board (SiCB) architecture using flip-chip bare die and through-silicon vias. This next-generation technology enables siXis to provide smaller, lighter, and lower power embedded computing modules for use in various markets including communications, medical imaging, test and measurement, high-performance computing, and defense and aerospace, as well as advanced semiconductor packaging.

“We needed a fab that could do both process development and provide a bridge to high-volume production,” said John Goehrke, founder and CEO. “SVTC distinguished themselves with their responsiveness, technical capabilities and business processes. They clearly understand our needs, and we’re looking forward to a very successful relationship.”

Joe Bronson, CEO of SVTC Technologies said, “We’re pleased to be working with siXis to help commercialize their remarkable technology. Startup companies such as siXis can depend on SVTC to develop and commercialize their unique products quickly in an open-access, IP-secure environment.”

David Blaker, siXis Vice President of Engineering, said the company’s embedded computing modules allow manufacturers to avoid building expensive application-specific integrated circuits (ASICs) for improved functionality.

“There’s a gap between programmable devices and ASICs, and we offer the opportunity to extend those programmable devices into higher-end systems,” Blaker said. “You can build a cutting-edge device with higher integration for one tenth the cost of an ASIC.”

Blaker added that siXis’ modules are lighter, more compact, and use less energy than traditional computing modules, filling an increasing market demand for reduced size, weight, and power (SWaP). The modules also enable faster memory processing, which lags the speed of logic devices. “Memory bandwidth is a real pain point in the marketplace, and we offer a cost-effective solution,” he said.

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siXis partners with SVTC to commercialize silicon circuit boards

August 24, 2009 — SVTC Technologies was chosen by technology startup siXis, Inc. to supply silicon manufacturing services for their compact, high-speed embedded computing modules that bridge the gap between programmable devices and costly, customized semiconductors.

The siXis modules utilize a unique silicon circuit board (SiCB) architecture using flip-chip bare die and through-silicon vias. This next-generation technology enables siXis to provide smaller, lighter, and lower power embedded computing modules for use in various markets including communications, medical imaging, test and measurement, high-performance computing, and defense and aerospace, as well as advanced semiconductor packaging.

“We needed a fab that could do both process development and provide a bridge to high-volume production,” said John Goehrke, founder and CEO. “SVTC distinguished themselves with their responsiveness, technical capabilities and business processes. They clearly understand our needs, and we’re looking forward to a very successful relationship.”

Joe Bronson, CEO of SVTC Technologies said, “We’re pleased to be working with siXis to help commercialize their remarkable technology. Startup companies such as siXis can depend on SVTC to develop and commercialize their unique products quickly in an open-access, IP-secure environment.”

David Blaker, siXis Vice President of Engineering, said the company’s embedded computing modules allow manufacturers to avoid building expensive application-specific integrated circuits (ASICs) for improved functionality.

“There’s a gap between programmable devices and ASICs, and we offer the opportunity to extend those programmable devices into higher-end systems,” Blaker said. “You can build a cutting-edge device with higher integration for one tenth the cost of an ASIC.”

Blaker added that siXis’ modules are lighter, more compact, and use less energy than traditional computing modules, filling an increasing market demand for reduced size, weight, and power (SWaP). The modules also enable faster memory processing, which lags the speed of logic devices. “Memory bandwidth is a real pain point in the marketplace, and we offer a cost-effective solution,” he said.

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LIVE NEWS FEED

NEW PRODUCTS

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05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...