Wafer-to-wafer Bonding: Using Pressure-indicating Film for Eutectic/Thermocompression Bonds

Kwan-yu Lai, Micralyne, and Jeffrey G. Stark, Sensor Products, describe the use of color-coded pressure-indicating film to ensure uniform, correct pressure during wafer bonding. Wafers are bonded by applying precise combinations of physical pressure, temperature, and/or voltage. Pressure is measured as an average, assuming perfectly flat pressure plates. In practice, the pressure plates are often non-ideal, or they may have degraded over time. Applied pressure characterization is important for high yielding eutectic/thermocompression bonds.

Bond recipes are tested for consistency then adjusted based on the results from the pressure-indicating film. There are also specific benefits that are distinct to each type of bonding application: metal eutectic bonding, anodic bonding, fusion bonding, metal diffusion bonding, glass frit bonding, polymer adhesive bonding.

Read the full article, “Pressure indicating film characterization of wafer-to-wafer bonding”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

DCG Systems extends circuit edit capability to the 10nm node with the introduction of OptiFIB Taipan
09/02/2015DCG Systems today announces the release of the OptiFIB Taipan circuit edit solution for the most adv...
SEMI-GAS unveils new custom-engineered ultra high purity liquid push system
09/02/2015The fully automatic system, operated by a GigaGuard PLC controller, features an intuitive 9” color touchscreen and user-def...
Compact point of use fluid delivery heater replaces multiple components in a system
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater...