Canada opens 200mm MEMS, 3D WLP center

September 2, 2009: A new Microelectronics Innovation Center is being formed at the Université de Sherbrooke in Bromont, Québec, to focus on 200mm microelectromechanical systems (MEMS) and 3D wafer-level packaging (WLP), and “advanced technologies associated with the assembly and packaging of silicon chips.”

Initial investments come from the governments of Québec ($94.95M) and Canada ($82.95M), and another $40.6M from center cofounders DALSA, IBM Canada, and the U. of Sherbrooke along with unidentified semiconductor equipment suppliers. Participatory interest also has been expressed by other universities, research centers, and industrial partners both in Canada and globally, they note.

The group’s stated “prime purpose” is to “leverage the best from the Canadian and international research community to address industry’s most challenging problems,” with end goals of both technology transfer and spinoffs. It also will be the centerpiece of a planned “true microelectronics cluster in Québec” hoped to extend from activities centered around Albany, NY. An estimated 250 researchers will be involved, and >3000 jobs will be created.

“The project marks the birth of a value chain that could eventually match the Québec economy’s flagship innovation sectors — life sciences, aerospace, and computer technologies,” said Clément Gignac., Minister of Economic Development, Innovation and Export Trade, in a statement.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Novel Wafer Analyzer for up to 300mm wafer using high speed Raman Imaging Technology
08/08/2016Nanophoton introduces RAMANdrive - a new Wafer Analyzer - for a wide range of applications at semiconductor market a...
Pfeiffer Vacuum introduces HiPace 2800 turbopump for ion implantation applications
07/06/2016Pfeiffer Vacuum has introduced the HiPace 2800 IT turbopump that is designed for ion implantation applications....
NanoFocus AG introduces new inspection system for semiconductors industry
05/31/2016NanoFocus AG, the developer and manufacturer of optical 3D surface measuring technology, introduces the new measuring system µ...