Advanced packaging materials conference scheduled for Cambridge University

December 17, 2009–The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM), to be held Feb. 28 through March 2 at Cambridge University, is being billed as the major spring 2010 event on electronics packaging, interconnection, and integration in Europe.

MicroTech-2010 will highlight disruptive technologies and APM featuring advanced polymer, organic ,and inorganic materials, and will include keynote talks, technical presentations, and exhibits designed to provide leading-edge coverage of developments in all areas of packaging materials and processes. This event will be held at Cambridge University’s Møller Centre, located near many new and established AP-related companies.

APM, Polytronic and MicroTech are major packaging materials forums, providing opportunities to network and meet leading experts and exchange up-to-date packaging knowledge in the field.

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