3) Invensas shows new xFD-based customer products with Etron Technology

Invensas

Invensas Corporation displayed its latest xFDTM products solutions at CES Las Vegas, Jan. 7 – 10, 2014, including cloud server module solutions featuring advanced registered dual inline memory modules (R-DIMMs) in collaboration with semiconductor manufacturer, Etron Technology, Inc., and memory module provider, ADATA Technology.

xFD technology connects multiple memory chips in a face-down shingle-stack configuration using ultra-short wirebonds. The solution significantly reduces the cost of server and datacenter operation by providing superior data access performance with significantly lower cooling costs and power usage.

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