7) MEMSIC announces wearable connected watch kit

memsic

MEMSIC, Inc. announced at CES 2014 the first of its kind connected watch SDK (MMW-SDK) with an integrated e-Compass. Its availability facilitates the rapid development of a wide range of wearable consumer electronic applications with connectivity to Apple and Android platforms.

The MMW-SDK takes advantage of the ultra low power and small size of the recently introduced MEMSIC MMC3416xPJ magnetometer, allowing developers to create innovative, always- on, wearable applications that enhance the user experience and utility of mobile handsets and tablets.  While using less than 50uA of current, the MMC3416xPJ can provide fast, highly accurate heading, rotation and attitude information which, combined with MEMSIC’s sensor fusion software, will enable applications to understand the context of the user, such as whether the user is standing, sitting, lying, walking or running, and can also assist in indoor navigation applications. The SDK also provides a wireless connection to another mobile device, further simplifying the development and integration process.

The MEMSIC electronic compass software provides a highly accurate fully tilt compensated electronic compass with calibration that supports MEMSIC’s recently introduced MMC3416xPJ ultra low noise, low power magnetometer in a 1.6 x 1.6 x 0.6 package.  High heading accuracy of the compass is enabled by the high performance and low noise of the MMC3416PJ. The MMW-SDK will be available in April 2014.

<<Previous     1   2   3   4   5   6   7   8   9     Next>>

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

One thought on “7) MEMSIC announces wearable connected watch kit

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...