X-Fab adds Semprius’ chip printing to foundry lineup January 13, 2009 – X-Fab Semiconductor Foundries AG and semiconductor printing startup Semprius have agreed to a partnership for turnkey silicon wafer fabrication, under which X-Fab will invest $1.5M in the company and become its designated foundry. Semprius’ technology involves microtransfer printing which transfers circuit elements from a semiconductor wafer to another substrate; benefits are said to be "massively parallel" and simultaneous printing of elements, high yields, and lower costs. Potential target markets include solar modules, electronic displays, and wireless devices. "The strategic relationship with X-FAB will provide our customers with ready access to world-class semiconductor fabrication in all aspects, from a Semprius-certified design kit to fully warranted wafer delivery," said Semprius president/CEO Joe Carr, in a statement. For X-Fab, adding Semprius IP and know-how in printed electronics "opens a multitude of new markets for our foundry business, and we foresee many areas of potential cooperation with Semprius," commented CEO Hans-Juergen Straub.