MHI ships first 200mm MEMS bonder

April 21, 2010 – Mitsubishi Heavy Industries (MHI) says it has delivered its first automated room-temperature bonding system for 200mm wafers to a MEMS manufacturer in Japan, the tool‘s first use in production.

The company’s MWB-08A tool incorporates a 20-wafer cassette (10 pairs) with fully automated wafer transfer and alignment. Bonding conditions are programmed for each wafer set, offering flexibility for small-lot production of various products. The tool’s functionality is compatible with earlier 150mm machines, so an upgrade path is available.

The tool transfer also includes MHI’s "Bonding Support Program," which liaises the company’s engineers and facilities with the customer to help support device development in applying room-temperature wafer bonding at each development stage: from conceptual design to functional prototype production to trial and mass production.

Room-temperature bonding activates the substrate surface with ion beam irradiation in a vacuum. Conventional wafer bonding applies heat; eliminating this step removes heat stress and strain, enabling rigidity and reliable bonding, and reduces cycle time (no heating/cooling cycle), the company explains. The end result is "significantly shorter production time," higher yields, and ultimately lower device production costs.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...