MHI ships first 200mm MEMS bonder April 21, 2010 – Mitsubishi Heavy Industries (MHI) says it has delivered its first automated room-temperature bonding system for 200mm wafers to a MEMS manufacturer in Japan, the tool‘s first use in production. The company’s MWB-08A tool incorporates a 20-wafer cassette (10 pairs) with fully automated wafer transfer and alignment. Bonding conditions are programmed for each wafer set, offering flexibility for small-lot production of various products. The tool’s functionality is compatible with earlier 150mm machines, so an upgrade path is available. The tool transfer also includes MHI’s "Bonding Support Program," which liaises the company’s engineers and facilities with the customer to help support device development in applying room-temperature wafer bonding at each development stage: from conceptual design to functional prototype production to trial and mass production. Room-temperature bonding activates the substrate surface with ion beam irradiation in a vacuum. Conventional wafer bonding applies heat; eliminating this step removes heat stress and strain, enabling rigidity and reliable bonding, and reduces cycle time (no heating/cooling cycle), the company explains. The end result is "significantly shorter production time," higher yields, and ultimately lower device production costs.