(July 22, 2010) — In this video, Hans Meiling, ASML, touches on extreme ultraviolet lithography’s (EUV’s) three required three components: process (resist), mask infrastructure and metrology, and exposure tool.
ASML is working on the exposure tool with 2 demo systems in the field and a production platform coming this year.
Hans Meiling, director of product management, EUV at ASML, gives sr. technical editor, Debra Vogler, a status report on EUV infrastructure readiness as well as the status of the exposure tool.
In summary, progress on resists is doing fine, and mask metrology is being tackled by SEMATECH’s project, but mask defectivity is not yet ready for high-volume manufacturing (HVM). And though progress on the source is on-going, by the time end users receive exposure tools — targeted for the end of 2010 — they will want 100W, or even 150 and 200W sources to be able to evaluate cost-effectiveness and get ready for HVM.
Also check out: