Carl Zeiss debuts SEM with enhanced resolution in the low kv region

(July 19, 2010) — Carl Zeiss introduced EVO HD, a conventional Scanning Electron Microscopy (C-SEM) system with higher resolution at low acceleration voltages. The EVO HD introduces High Definition to electron microscopy.

Click to Enlarge

Figure 1. Scale of butterfly wing (Pieris Brassicae) taken on the new EVO HD electron microscope at 5kV acceleration voltage. The combination of the groundbreaking high source brightness of the EVO HD and the enhanced low-kV sensitivity of the detector allows for more insight into such non-conductive biological nano-structures. Nano-textures associated with biological structures have attracted considerable attention not just in Zoology, but also in Material Science, bio-mimicry and nano-engineering. (Photo: Business Wire)

The technological basis for this achievement is the new EVO HD source, which features a higher source brightness. This brightness results in an improvement in resolution at low-kV relative to conventional tungsten SEMs. The improved source properties also aid analytical applications with a 30% increase in resolution at 30kV and 1nA.

“We are convinced that this is the most significant innovation in the market for conventional SEM in the last decade. Numerous applications in both life sciences and materials analysis will benefit from the increased performance,” explains Allister Mc Bride from Carl Zeiss Nano Technology Systems division at Cambridge.

The Carl Zeiss Group operates worldwide in the optical and opto-electronic industries. Carl Zeiss SMT AG comprises the Semiconductor Technology Group of the Carl Zeiss Group, manufacturing lithography optics and light, electron and ion-optical inspection, analysis and measuring systems. Further information is available at

Also read:
Zeiss tool put to work finding rock-encased hydrocarbons

SPIE/BACUS: NIL in patterned media…but when for ICs?

Carl Zeiss delivers "complete" optics for production EUV

Zeiss debuts "correlative microscopy" elements


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...