Carl Zeiss debuts SEM with enhanced resolution in the low kv region

(July 19, 2010) – Carl Zeiss introduced EVO HD, a conventional Scanning Electron Microscopy (C-SEM) system with higher resolution at low acceleration voltages. The EVO HD introduces High Definition to electron microscopy.

Click to Enlarge

Figure 1. Scale of butterfly wing (Pieris Brassicae) taken on the new EVO HD electron microscope at 5kV acceleration voltage. The combination of the groundbreaking high source brightness of the EVO HD and the enhanced low-kV sensitivity of the detector allows for more insight into such non-conductive biological nano-structures. Nano-textures associated with biological structures have attracted considerable attention not just in Zoology, but also in Material Science, bio-mimicry and nano-engineering. (Photo: Business Wire)

The technological basis for this achievement is the new EVO HD source, which features a higher source brightness. This brightness results in an improvement in resolution at low-kV relative to conventional tungsten SEMs. The improved source properties also aid analytical applications with a 30% increase in resolution at 30kV and 1nA.

“We are convinced that this is the most significant innovation in the market for conventional SEM in the last decade. Numerous applications in both life sciences and materials analysis will benefit from the increased performance,” explains Allister Mc Bride from Carl Zeiss Nano Technology Systems division at Cambridge.

The Carl Zeiss Group operates worldwide in the optical and opto-electronic industries. Carl Zeiss SMT AG comprises the Semiconductor Technology Group of the Carl Zeiss Group, manufacturing lithography optics and light, electron and ion-optical inspection, analysis and measuring systems. Further information is available at

Also read:
Zeiss tool put to work finding rock-encased hydrocarbons

SPIE/BACUS: NIL in patterned media…but when for ICs?

Carl Zeiss delivers "complete" optics for production EUV

Zeiss debuts "correlative microscopy" elements


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...