EUV news from SEMICON West with Toppan Photomasks

(July 20, 2010) — Franklin Kalk, Toppan Photomasks, comments on the big EUV lithography news annouced at SEMICON West. Technical challenges of EUV remain defect management — finding and fixing defects in masks. Pattern mask inspection may not be ready until 2016.

More on EUV:
SEMICON West: Lithography trends at Sokudo breakfast forum

Imec and ASML demonstrate potential of 193nm immersion lithography

DUV inspection and defect origin analysis for 22nm spacer self-aligned double-patterning 

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....