(July 23, 2010) — In these three video interviews from SEMICON West 2010, Leti research directors speak with senior technical editor Debra Vogler. Yannick Le Tiec discusses cleaning; Michel Brillouet speaks on 3D packaging work, and Didier Louis updates us on advanced lithography.
In "Leti Advanced Lithography Program update," Didier Louis, International Communication Project Leader at Leti, summarizes the status of lithography development at the organization. Leti is pursuing two alternatives to “waiting for EUV:” maskless, multi-beam lithography and dry, 193nm lithography with double-patterning and a spacer. Louis reports that 15nm resolution has been attained for isolated lines. Didier also presented at the lithography breakfast at SEMICON.
In "Leti cleaning methodology update," Yannick Le Tiec, Leti’s assignee to IBM, talks about developing new protocols for cleaning at 32nm and below. They are targeting low-power applications, and find some better than others.
Finally, in "Leti update on 3D packaging," Michel Brillouet brings us up-to-date on Leti’s 3D packaging tech: wafer thinning and bonding, and the associated handling concerns. Integration for wireless applications is Leti’s current interest. Partnerships enable better package design. Read more about advanced packaging here.