Imec IEDM presentations to cover More than Moore, ITRS

(August 19, 2010) — 16 papers with imec authors were accepted for IEEE International Electron Devices Meeting (IEDM), December 6-8, 2010, in San Francisco. Both ITRS-related as well as More-than-Moore-related research papers have been accepted, rewarding imec’s multidisciplinary R&D platform (featuring two state-of-the-art R&D fabs).

With 11 papers on ITRS scaling topics, imec will discuss a significant contribution to the fundamental understanding on the switching behavior and operation in advanced memory concepts (i.e. resistive RAM (RRAM) devices), among other topics. This has been achieved by applying imec’s longstanding expertise in logic MOS and high-k/metal gate reliability. It demonstrates the power of leveraging expertise from various domains in a flexible manner.

A 2nd highlight demonstrates imec’s continued progress on 3D-through-silicon via (TSV) technology, which is at the forefront of new and enabling ITRS technologies. The paper reports important characterization data of a two-die stacked device combining TSV with high-k/metal gate devices.

In addition, 5 More-than-Moore related topics will be presented at IEDM, covering GaN technology, Si high-voltage devices and MEMS technologies. One particular result is the realization of a high performance MEMS device together with one of our industrial core partners. Imec’s MEMS R&D expertise was applied to provide an industry-relevant solution.

Imec is committed to continue to lead in R&D of 300mm ITRS process technologies, but is also expanding its value offering in More-than-Moore leveraging its 200mm platform. Learn more at www.imec.be.

Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...