LCP QFN packaging tech supports finer pitch, thinner leadframes

(September 23, 2010) — RJR Polymers, developer of high-performance semiconductor packaging, debuted a new generation of Liquid Crystal Polymer (LCP) quad flat-pack no-lead (QFN), air-cavity packages that will support finer lead pitches, thinner leadframes and shorter wire bond lengths in a near hermetic, ROHS-compliant solution.

Able to withstand three non-lead reflows while remaining leak tight, these new MSL III packages will support leadframes as thin as 0.008in (0.20mm) and greater.

In early testing the new QFN packages have repeatedly passed over 500 thermal cycles from -65° to +150°C with no gross leak failures. The packages have also been successfully tested with a variety of plating types including NiAu and NiPdAu finishes. The packages can be tailored to address specific conditions and requirements of any assembly process.

RJR Polymer’s line of LCP QFN solutions offers a number of advantages over traditional ceramic QFN packaging options. These air cavity packages support high frequency performance up to 38 GHz, and demonstrate a return loss (S11) of more than -15 dB and insertion loss (S21) of less than -0.5 dB in the Ku-band. At the same time the technology’s use of a solid metal die pad delivers significantly better thermal management capabilities than traditional ceramic solutions. The technology’s 0.02% moisture absorption rate enables the development of near-hermetic packages. The LCP process is said to have a relatively low cost of entry for a proven platform.

“Over the last few years or so our LCP QFN packages have offered a highly attractive solution for commercial microwave and millimeter wave applications, but have been limited by lead pitch and package frame dimensions,” noted Dave DeWire, director of sales and marketing. “With finer lead pitches and thinner lead frames, LCP-based QFN solutions can reach a wider array of applications.”

RJR Polymers, Inc. is a developer of LCP semiconductor packaging, epoxies, epoxy-coated lids and sealing equipment for a wide variety of applications in the RF, cellular, automotive, optical, imaging, avionics and sensor markets as well as emerging applications in solar power, high-power LEDs and system-level solutions that require extremely high levels of integration. For more information, visit the company’s website at www.rjrpolymers.com.

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Also read: Wafer-level Microbumping for Flip Chips, by JEAN-CHARLES SOURIAU, JEAN BRUN, RÉMI FRANIATTE, LYDIE MATHIEU, GÉRARD PONTHENIER, AND NICOLAS SILLON
and Wafer-level Hermetic Cavity Packaging by George A. Riley

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