Proteus Biomed chooses IC test house Integra for new designs

(September 20, 2010) — Integra Technologies LLC, IC test and evaluation services provider, was selected by Proteus Biomedical Inc. for development and production test of their new integrated circuit (IC) designs.

Proteus’ products address therapeutic areas where disease management complexity, patient monitoring requirements, therapeutic efficacy, and poor patient adherence create large clinical and commercial opportunities. The company currently has two product platforms in development for application in immunology, diabetes, tuberculosis, HIV, cardiac disease and CNS disorders. Visit the medical and life sciences center on here.

Commenting on the new partnership, Ben Costello, VP of product engineering of Proteus Biomedical, cited Integra’s experience, engineering expertise, certifications, quality record and manufacturing capability as reasons for the contract. 

"Proteus has exciting products coming to market and we look forward to utilizing our substantial engineering and manufacturing expertise and capacity to support their successful introduction and volume ramp," added Joe Holt, president of business development for Integra. Watch a video interview with Andrew Thompson, Proteus Biomedical, about medical electronics here.

Proteus Biomedical’s body-powered and implantable technologies are the foundation for the development of the company’s intelligent medical products. More information about Proteus Biomedical can be found at

Integra Technologies is an independent test lab in the U.S and Europe and is a full service test supplier. Services include: Test Development, Final Test, Characterization, Wafer Probe, ESD, Latch-Up, Qualification services (HTOL, HAST, Temp Cycle, etc.) and assembly (outsourced to qualified partners). Additional information about Integra Technologies can be found at  

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on by clicking Or join our Facebook group


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...