TSV wafer measurement tool selected by 2 semiconductor equipment makers

(September 16, 2010) — Tamar Technology received orders from two major semiconductor equipment manufacturers for its through-silicon via (TSV) measurement technology. Tamar’s proprietary Wafer Thickness Sensor (WTS) can measure etch depth for TSVs as well as wafer thickness for single or bonded wafers. Tamar’s technology is non-destructive and can perform TSV measurements independent of diameter or depth.

"One of the systems has already been delivered and the second will be delivered before the end of the year," says David Grant, president of Tamar Technology. "Both systems will be used to help develop processes for etching TSVs and thinning wafers. The non-destructive nature of the technology allows processes to be monitored and developed in substantially less time and with less cost. Not only can a wafer be etched multiple times, but there is no need for the destructive and expensive measurements on a scanning electron microscope."

Wafer thinning processes also benefit from WTS technology since a map of wafer thickness can be provided that shows process developers how the equipment is behaving and if the thinned wafers are consistent.

Tamar also announced that it is working on fully automated production systems that will integrate into 200mm and 300mm fabs. Those systems are expected to be ready for shipment in the first quarter of 2011. 

Tamar Technology is a precision metrology company specializing in systems for the semiconductor, hard disk drive and medical device industries. For more information, contact Russ Dudley at (805) 480-3358, rdudley@tamartechnology.com.

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