(October 15, 2010 – PRNewswire) — EoPlex Inc. debuted a high-performance, clean-tech lead carrier for semiconductor packaging. EoPlex xLC is reportedly a cost-effective replacement for the leadframes currently used in quad flat pack no-lead (QFN) packages.
QFNs are the fastest growing packaging segment, because they typically are the smallest and least expensive package. However, conventional QFN lead frames are limited in performance due to design restrictions of the current processes. In addition, they require etching and plating steps that create waste chemicals. EoPlex xLC overcomes these design restrictions in a green process that eliminates etching and plating. Size and cost advantages of QFN packages can now be applied to devices that were limited to more expensive and bulkier packaging technology.
EoPlex xLC is a sintered composite with an engineered microstructure that is based on the company’s proprietary materials and processing technology. With EoPlex xLC, complete packages can have from 2 to 500+ leads and still be less than 300um thick. EoPlex supplies xLC carriers to customers in the semiconductor, packaging and assembly industries. Initial applications are in portable electronics including cell phones, laptops, mp3 players, GPS, cameras and wireless devices.
We’ve introduced a product that combines clean technology with performance and cost advantages for our customers, said Arthur L. Chait, CEO of EoPlex. "We see this as part of a growing trend where clean manufacturing actually results in a better product and a lower cost." EoPlex currently has a small factory at its headquarters in Redwood City, CA, and plans to open full-size factories in locations that best support its customers.
EoPlex is a private company backed by Draper Fisher Jurvetson, ATA Ventures, Labrador Ventures and Draper-Richards. More information is at www.eoplex.com. EoPlex will be raising an expansion round of capital in 2011 and interested parties should contact Arthur L. Chait directly at email@example.com.