New 300mm TSV production processes aim of SPTS, CEA-Leti partnership

(October 6, 2010) — CEA-Leti and SPP Process Technology Systems (SPTS) have agreed to develop advanced 300mm through-silicon via (TSV) 3D IC processes at CEA-Leti’s 300mm facilities in Grenoble, France. The agreement defines their collaboration on a range of 3D TSV processes to optimize etch and deposition technologies used to create next-generation high aspect ratio TSVs.

The partners will research alternative hardware and processes to address the need for new methods of cost-effective via fill. In some via-middle applications, where the via is created between contact and first back-end-of-line (BEOL) metal layer, via aspect ratios may extend beyond 10:1, and these very high aspect ratios require a new approach to current etch and deposition techniques. 

"3D-IC technology plays a key role in enabling cost-effective performance for the entire micro-electronics industry. Whether for nomadic devices, data centers, MEMS or optical devices, 3D-ICs form the basis of building cost-effective, high performance chips with multiple functionalities. Combining Leti’s advanced research and development knowledge with the technical expertise from an equipment manufacturer with proven production capabilities will cover the complete range of Copper-based TSV processes," said Dr. Laurent Malier, CEO of CEA-Leti. SPTS is encouraged by the possibilities in this joint equipment-and-process development with CEA-LETI, added Kevin Crofton, managing director, SPTS UK Division, and executive vice president, SPTS. “Our etch, physical vapor deposition (PVD) and chemical vapor deposition (CVD) systems are acknowledged technology leaders in the field of TSVs. Leti and SPTS understand the importance and value of creating an optimized TSV solution, and both acknowledge that it is most effective when the wafer-processing-technology and device experts are working together on integrated process flows.”

TSV technology is quickly gaining industry prominence as this method of 3D integration facilitates a thinner interconnect layer between stacked devices, allowing higher density interconnectivity to produce better electrical performance, all resulting in increased functionality and cost-efficiencies, say the partners.

CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defense and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications. For more information about Leti, please visit www.leti.fr.

SPP Process Technology Systems was established in October 2009 as the vehicle for the merger of Surface Technology Systems and to acquire assets of Aviza Technology. The company is a wholly owned subsidiary of Sumitomo Precision Products Co., LTD, and designs, manufactures, sells, and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. For more information on SPTS please see www.spp-pts.com

Sumitomo Precision Products Co., Ltd, expanded from their core field of aerospace products into such diverse areas as heat-exchangers and heat-control systems, industrial machinery employing hydraulic control, equipment for semiconductor and flat panel display production, ozone generators for protecting the environment and unique motion sensors. For more information about SPP, please visit www.spp.co.jp

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