Achronix-FPGA-built-on-Intel-22nm-fab tech

(November 1, 2010) — Achronix Semiconductor Corp. announced strategic access to Intel Corporation’s 22nm process technology, and plans to develop the most advanced field programmable gate arrays (FPGAs).

The Achronix Speedster22i FPGA family targets cost-effective production for high performance devices over 2.5M LUTs in size, equivalent to an ASIC of over 20 million gates. Taking advantage of the performance and power savings of Intel’s 22nm process technology, Speedster22i will also extend the boundaries of FPGA speed and power efficiency, enabling as much as 300% higher performance, 50% lower power, and 40% lower cost than any other FPGA in any other process technology.

Achronix Speedster22i will be suitable for applications in the telecommunication, networking, industrial and consumer markets and will enable emerging applications such as 100G, 400G Ethernet networking and LTE mobile communications. Additionally, Speedster22i can be commercially manufactured in the US, suiting military and aerospace applications requiring "on shore" silicon.

"Intel’s manufacturing strengths and lead in process technology offers leadership cost, performance and power efficiency benefits, giving Intel and our manufacturing customers such as Achronix an opportunity to design products with superior capabilities,” said Sunit Rikhi, vice president, Technology and Manufacturing Group, Intel.

“Intel has the best process technology in the world and we are privileged to have formed this strategic relationship, which enables simultaneous improvements in speed, power, density and cost,” said John Lofton Holt, CEO of Achronix. “The combination of the advanced 22nm process from Intel and the advanced FPGA technology from Achronix enables Speedster22i to eclipse other FPGA solutions expected to hit the market in the next few years.”

Achronix Semiconductor is a privately held fabless corporation that builds field programmable gate arrays (FPGAs) capable of up to 1.5 GHz peak performance. Find out more at http://www.achronix.com.

Subscribe to Solid State Technology/Advanced Packaging. Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...