Fujitsu-transfers-flip-chip-to-China

(November 29, 2010 – Asia Pulse) — Japan’s Fujitsu Semiconductor Ltd. will transfer its flip chip mounting technology to a Chinese group affiliate for system chip assembly.

Flip chip mounting attaches semiconductor chips directly to boards with solder bumps, eliminating the need for metal lead wires. This speeds assembly, enables chips to be designed thinner, and reduces power consumption.

Before the end of the year, the Fujitsu Ltd. (TSE:6702) arm will transfer some of the manufacturing equipment from its main domestic factory in Mie Prefecture to Nantong Fujitsu Microelectronics Co (SSE:002156), a Jiangsu Province joint venture in which the Fujitsu group owns a roughly 20% stake.

This will mark the first time that a leading Japanese chipmaker transfers such advanced mounting technology to China. Fujitsu Semiconductor is doing this to strengthen Chinese operations and better compete with rivals like Texas Instruments Inc. and Renesas Technology Corp., which have bolstered their own production operations in China to cut costs.

Fujitsu Semiconductor will also collaborate with Nantong Fujitsu to open an R&D center in the city of Nantong this December. The company will dispatch engineers to this center so they can work with Chinese counterparts to develop chip assembly technologies meeting the needs of China’s electronics manufacturing service providers.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...