LED-substrates-singulation-Jan-Vardaman

(November 16, 2010) — Speaking at the MEPTEC Semiconductor Packaging Roadmaps conference (Santa Clara, CA; 11/10/10), Jan Vardaman, president of TechSearch International, said that there is room for improvement in LED packaging and assembly.

In this podcast interview with Debra Vogler, senior technical editor, Vardaman discusses sapphire and SiC substrates, as well as the various singulation methods currently in use by LED manufacturers (e.g., laser, stealth dicing, mechanical blade dicing, etc.). The key factor to methodology is obtaining the maximum light output. Vardaman expects that there will continue to be a plethora of process, assembly, and packaging solutions for the next few years.

Listen to Vardaman’s talk: Download or Play Now

Vardaman told MEPTEC attendees that OIDA predicts that by 2021, 32% of HB-LEDs will be on 4" wafers. Currently, 2" and 3" wafers are in high-volume production with volume production of 4" wafers having started in 2008. Four-inch wafers still cost more than 4× 2" wafers, observed Vardaman. R&D for 6" wafers started in 2008 and these are going into production volumes now, she added, while R&D on 8" wafers is currently underway. 

She also lamented the lack of standards for packaging. “The footprints of LED packaging are not even the same,” she said. The industry will also have to understand optical, thermal, and material science trade-offs to enable reliable, low-cost products.

More on packaging roadmaps:

IFTLE 17: ITRS Assembly and Packaging Roadmap

Lee Smith, Amkor, on the 3 generations of 3D packaging

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