DEK-VectorGuard-3D-stencils-for-chip-on-board

(December 3, 2010) — DEK has launched an addition to its VectorGuard stencil range. VectorGuard 3D stencils are designed for specialist applications requiring multiple level printing. Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables a uniform stencil thickness.

Targeted at applications consisting of different levels on the PCB or substrate, the electroformed nickel VectorGuard 3D Stencil prints two levels at the same time, accommodating levels that differ by up to 3mm. Previously, devices such as power transistors requiring support on multiple levels, necessitated a dispensing operation following stencil print. VectorGuard 3D eliminates the dispenser requirement. VectorGuard 3D meets the challenges of providing coverage for dedicated areas on the board, such as chip on board (COB). Equally, the process can be used to protect bonding areas from contact with the stencil. Other applications particularly suited to VectorGuard 3D include printing of heatsink pockets for power components or printing of 3D mounting PCBs.

By avoiding the process of using thick stencils and milling down print areas, the 3D model is said to reduce stencil stress and increase process reliability.

VectorGuard 3D stencils will be individually engineered to meet specific application requirements.

Visit www.dek.com for more information.

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