DEK-VectorGuard-3D-stencils-for-chip-on-board

(December 3, 2010) — DEK has launched an addition to its VectorGuard stencil range. VectorGuard 3D stencils are designed for specialist applications requiring multiple level printing. Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables a uniform stencil thickness.

Targeted at applications consisting of different levels on the PCB or substrate, the electroformed nickel VectorGuard 3D Stencil prints two levels at the same time, accommodating levels that differ by up to 3mm. Previously, devices such as power transistors requiring support on multiple levels, necessitated a dispensing operation following stencil print. VectorGuard 3D eliminates the dispenser requirement. VectorGuard 3D meets the challenges of providing coverage for dedicated areas on the board, such as chip on board (COB). Equally, the process can be used to protect bonding areas from contact with the stencil. Other applications particularly suited to VectorGuard 3D include printing of heatsink pockets for power components or printing of 3D mounting PCBs.

By avoiding the process of using thick stencils and milling down print areas, the 3D model is said to reduce stencil stress and increase process reliability.

VectorGuard 3D stencils will be individually engineered to meet specific application requirements.

Visit www.dek.com for more information.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...