IEDM observations: Getting back to the mechanical in MEMS

(December 17, 2010) — Techcet’s Michael A. Fury reports in-depth from sessions at IEDM 2010, held earlier this month in San Francisco, looking at paper 18.3 on a reverse trend from electronic switching back to mechanical switching in the form of MEMS devices. 18.3, "Prospects for MEM Logic Switch Technology (Invited)," was presented by T.-J. King Liu, J. Jeon, R. Nathanael, H. Kam, V. Pott*, E. Alon, University of California, Berkeley, *Institute of Microelectronics.

18.3: Device leakage and RF channel switching are among the problems driving a reverse trend from electronic switching back to mechanical switching in the form of MEMS devices, as presented in an invited talk by Tsu-Jae King Liu of UC Berkeley. A MEMS air gap of 1nm can provide IOn/IOff ~ 1010. Planar plates are used as actuating elements rather than linear mechanical levers; a see-saw configuration guarantees that complementary logic functions can be satisfied. Devices have been shown to endure 1015 cycles, satisfying most wireless applications with a 10-year lifetime. MEMS logic functions can be fabricated with 2×-4× fewer devices than the corresponding CMOS functions.

 

(a) 3D schematic of the see-saw relay structure and definition of design parameters. (b) Schematic cross-sections illustrating complementary operation. (c) SEM views of a fabricated see-saw relay.

Michael A. Fury, Ph.D., reports on a range of talks at IEDM 2010:

He is senior technology analyst at Techcet Group, LLC, P.O. Box 29, Del Mar, CA 92014; mfury@techcet.com.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...