MEMS packaging conference planned for 2011

(December 28, 2010) – The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.

Using the right MEMS packaging is critical for product sucess, point out the conference organizers. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet goals for product performance, durability, and total cost. Learn about extension of existing technology, exciting new technologies coming up, how to make MEMS packaging more specific to applications, and what’s going on in research. Examples of strengths and shortcomings of various packaging schemes are included.

The conference invites product design engineers and engineering managers of MEMS device manufacturers to attend, as well as engineers, managers, and system designers who use MEMS devices in their products.

This program is a joint presentation by U-M Electrical Engineering and Computer Science, The Center for Wireless Integrated MicroSystems (WIMS), and The Center for Professional Development.

Register online at www.InterPro.engin.umich.edu

The Center for Wireless Integrated Micro Systems (WIMS) is a world leader in developing packaging technology for a variety of MEMS systems. For more information about WIMS including education, research highlights, patents, and publications, see www.wimserc.org

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