(December 14, 2010) — PCB Piezotronics (PCB) has expanded their sensor product line to include several MEMS devices using silicon-based technology. Development and production of these sensors used a Plasma-Therm VERSALINE DSE system for several critical deep silicon etching fabrication steps.
PCB’s MEMS-based sensor products include a series of shock accelerometers utilized in industrial monitoring applications such as load vibration, pile driving and hole drilling. Additionally, these products are used in aerospace and defense.
Successful etching of a complex silicon-on-insulator (SOI) MEMS device structure enables PCB to produce small, accurate, and durable shock accelerometers. The company selected Plasma-Therm’s low notch etch technology for its MEMS processes.
“We developed our MEMS shock accelerometer series using the etch technology provided by the VERSALINE DSE system. This system has been a crucial element in advancing our sensor technology product collection. Working with an equipment supplier with Plasma-Therm’s expertise was a critical part of our product development,” stated Andrea Tombros, senior MEMS design engineer at PCB.
PCB Piezotronics is a global leader in the design and manufacture of force, torque, load, strain, pressure, acoustic and vibration sensors, as well as the pioneer of ICP technology.
Plasma-Therm is a supplier of advanced plasma process equipment offers etch and deposition technologies. Learn more at www.plasmatherm.com