Semi LED fab capacity: Cause for concern, says Dieseldorff, SEMI

 

By Debra Vogler, senior technical editor

January 24, 2011 – Speaking at SEMI’s Industry Strategy Symposium (ISS) in January, Christian Dieseldorff, SEMI’s senior analyst, provided an in-depth look at fab construction, capacity, and capex in 2011 and 2012 (see figures).

Listen to Dieseldorff’s interview:  Download for iPhone/iPod users  or Play Now

In this podcast, Dieseldorff walks listeners through fab construction projects by region and device type (LED, non-memory, memory, etc.). He speaks with Debra Vogler, senior technical editor.

Click to Enlarge

Figure 1. Fab spending on front end facilities (Construction and equipping, including discretes). SOURCE: SEMI

Dieseldorff sees a decline in construction projects in 2011, followed by a double-digit decline in projects in 2012.

Click to Enlarge

Figure 2. Fab construction projects: Count of fabs vs. type. SOURCE: SEMI

Breaking out LED fabs, Dieseldorff notes that the largest growth regions (capacity and number of participating companies) are China, Taiwan and Korea. For 2011 and 2012, however, there aren’t many new LED fabs. 

Click to Enlarge

Figure 3. Equipping fabs — chip sales & capex trends: Both riding the same rollercoaster. SOURCE: SEMI

Subscribe to Solid State Technology/Advanced Packaging.

Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi.

Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...