Semi LED fab capacity: Cause for concern, says Dieseldorff, SEMI

 

By Debra Vogler, senior technical editor

January 24, 2011 — Speaking at SEMI’s Industry Strategy Symposium (ISS) in January, Christian Dieseldorff, SEMI’s senior analyst, provided an in-depth look at fab construction, capacity, and capex in 2011 and 2012 (see figures).

Listen to Dieseldorff’s interview:  Download for iPhone/iPod users  or Play Now

In this podcast, Dieseldorff walks listeners through fab construction projects by region and device type (LED, non-memory, memory, etc.). He speaks with Debra Vogler, senior technical editor.

Click to Enlarge

Figure 1. Fab spending on front end facilities (Construction and equipping, including discretes). SOURCE: SEMI

Dieseldorff sees a decline in construction projects in 2011, followed by a double-digit decline in projects in 2012.

Click to Enlarge

Figure 2. Fab construction projects: Count of fabs vs. type. SOURCE: SEMI

Breaking out LED fabs, Dieseldorff notes that the largest growth regions (capacity and number of participating companies) are China, Taiwan and Korea. For 2011 and 2012, however, there aren’t many new LED fabs. 

Click to Enlarge

Figure 3. Equipping fabs — chip sales & capex trends: Both riding the same rollercoaster. SOURCE: SEMI

Subscribe to Solid State Technology/Advanced Packaging.

Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi.

Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...