Samsung announces wide I/O DRAM with TSVs for mobile apps

by Dr. Phil Garrou, contributing editor

February 27, 2011 – Samsung — who in December 2010 announced 40nm 8GB RDIMM based on 4Gb, 1.5V, 40nm DDR3 memory chips operating at 1,333MHz and 3D TSV chip stacking architecture for servers applications — announced at the International Solid-State Circuits Conference (ISSCC, Feb. 20-24 in San Francisco) the development of wide I/O 1Gb DRAM for mobile applications like smartphones and tablet computers. The 3D TSV architecture will be implemented in their 50nm node DRAM technology.

Previous generations of mobile DRAM, low-power DDR2 DRAM (LPDDR2) which runs at approximately 3.2-Gb/ sec, uses a maximum of 32 pins for I/O. The new wide I/O solution, which has 512 I/O (up to 1200 total pins), can transmit data at a rate of 12.8Gb/sec, resulting in a significant improvement in processing power. In addition it reportedly reduces the power consumption by 75%.

Following this wide I/O DRAM launch, Samsung is reportedly focusing on 20nm, 4Gb wide I/O mobile DRAM for delivery in 2013.

The 64.34mm2 is made up of 4 partitions symmetric with respect to the chip center, each partition consisting of 4×64Mb arrays, peripheral circuits and microbumps. The microbumps are 20×17μm2 on 50μm pitch. The TSVs are 7.5μm diameter with 0.22 – 0.24Ω resistance and 47.4fF capacitance.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

VaporSorb filter line protects advanced yield production from Entegris
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....
SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...