austriamicrosystems-sends-high-voltage-0.18micron-CMOS-process-to-volume-production-at-IBM

March 30, 2011 – BUSINESS WIREaustriamicrosystems (SIX:AMS) conditionally released its advanced 0.18µm High-Voltage CMOS process technology "H18" to for volume production. It will be manufactured in IBM’s 200mm Burlington, VT, wafer facility.

Jointly developed with IBM, the 0.18µm High-Voltage CMOS process is the 6th generation of continuously improved High-Voltage CMOS technologies developed at austriamicrosystems.

Featuring a new level of RF and HV integration capability on a single IC, the new 0.18µm High-Voltage CMOS process offers integration density up to 118k gates/mm2, enabling system on chip (SoC) applications and power-on resistance (Rdson) for silicon area reduction. The integration capabilities of H18 enable design houses and IDMs to create new applications in areas such as smart sensors, sensor interface devices, smart meters, industrial and building controls and LED lighting control.

Only a few mask level adders are required on top of the fully compatible CMOS base process to implement high-voltage capabilities. The process allows the integration of 1.8V, 5V, 20V and 50V devices on a single chip without process modifications. Process features such as Schottky barrier diode, high-resistive and precision poly, single- and dual metal-insulator-metal (MIM) capacitors, varactors and up to 7 metal layers including thick last metal complete the High-Voltage H18 CMOS process.

Modular SoC designs using H18 can integrate analog high-voltage blocks with RF CMOS, extended digital functions and micro-controllers, said Thomas Riener, SVP and GM of austriamicrosystems’ Full Service Foundry business unit. "The H18 technology is now ramping in a broad range of smart green applications such as power management for photovoltaics and LED driver applications."

Learn more at http://www.austriamicrosystems.com 

Subscribe to Solid State Technology/Advanced Packaging.

Follow Solid State Technology on Twitter.com via editors Pete Singer, twitter.com/PetesTweetsPW and Debra Vogler, twitter.com/dvogler_PV_semi.

Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Novel Wafer Analyzer for up to 300mm wafer using high speed Raman Imaging Technology
08/08/2016Nanophoton introduces RAMANdrive - a new Wafer Analyzer - for a wide range of applications at semiconductor market a...
Pfeiffer Vacuum introduces HiPace 2800 turbopump for ion implantation applications
07/06/2016Pfeiffer Vacuum has introduced the HiPace 2800 IT turbopump that is designed for ion implantation applications....
NanoFocus AG introduces new inspection system for semiconductors industry
05/31/2016NanoFocus AG, the developer and manufacturer of optical 3D surface measuring technology, introduces the new measuring system µ...