Japan quake hampering package substrate supplies

March 16, 2011 – We’ve been tracking the Japan earthquake’s impact on the semiconductor community, including a constantly updated list of facilities impacted and a broader view of the impact on global markets. But there’s one angle to this tragedy that could directly affect the semiconductor packaging sector.

Apparently one of the bigger problems is a growing shortage of bismaleimide triazine (BT) resin, a material used in many chip package substrates. BT is mainly sourced in Japan, and key supplier Mitsubishi Gas Chemical is among the many companies facing potential production outages. "Shortage of BT resin would most impact Xilinx (50% exposed), Altera (40% exposed), and Qualcomm (30% exposed)," writes Craig Berger from FBR Research.

Further downstream this affects PBGA packages produced by backend assembly/test firms including ASE, Siliconware Precision (SPIL), and Amkor, Berger notes. Credit Suisse analysts add substrate companies Kinsus and Unimicron to the list as well.

Even further down the packaging chain, most raw materials for printed circuit boards (PCB) are supplied outside of Japan, Credit Suisse notes. Production outages at JX Nippon, a major supplier of RA foil, should be partially offset by other sources in Taiwan (Furukawa Copper foil, Taiwan Copper Foil) and the US (Olimbrass).

Also read:
Letter from Japan: Update on infrastructure, fab status after earthquake

News from Japan on the Impact of Disasters 

Japan earthquake’s impact on semiconductor community

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...