March 14, 2011 – Marketwire — Mattson Technology Inc. (NASDAQ: MTSN), advanced semiconductor process equipment supplier, introduced SUPREMA XP5 photoresist dry strip system for high-volume production of current and future-generation logic, DRAM and flash memory devices.
The SUPREMA XP5’s modular platform uses a simplified vacuum-based wafer transfer architecture designed to meet next-generation strip requirements with improved cost of ownership (COO), increased reliability and best-of-class particle performance to meet next-generation cleanliness requirements. The system features a simplified, combined vacuum loadlock and transfer module with a unique architecture to enable faster time to production and reduce the use of moving and consumable parts. SUPREMA XP5 provides the capability to run recipes at higher source power and features improved system packaging to simplify and lower costs related to installation, maintenance and serviceability.
It is based on the vacuum-based, high-throughput SUPREMA platform and proprietary Faraday-shielded inductively coupled plasma (ICP) source technology. SUPREMA XP5 provides the most flexible and cost-effective solution for advanced front-end-of-line (FEOL) and back-end-of-line (BEOL) strip applications using oxygen-based process chemistries. Reliable, high-speed vacuum and atmospheric robotics deliver throughput of greater than 430 wafers per hour. The SUPREMA XP5 suits manufacturing of advanced chips down through the 2X nanometer (nm) node.
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. Learn more at www.mattson.com.