Optomec aerosol jet printing featured as wire bond, TSV alternative at IMAPS Device Packaging

March 8, 2011 – BUSINESS WIRE — Optomec Aerosol Jet product manager Mike O’Reilly will give a presentation titled "Aerosol Jet Printing as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications" at the IMAPS (International Microelectronics and Packaging Society) Device Packaging Conference on March 9.

O’Reilly will discuss how, based on cost and functional advantages, the Aerosol Jet process is emerging as an effective alternative to traditional wire bond and through-silicon-via (TSV) technologies. Aerosol Jet systems have high-density 3D interconnect capabilities that enable multi-functional integrated circuits (ICs) to be stacked and vertically interconnected in high-performance system-in-package (SiP) devices. The die stacks can include 8 or more die, with a total stack height of ~1mm.

The printing system has a working distance of several millimeters, which means that no Z-height adjustments are required for the interconnect printing. Closely coupled pneumatic atomizers with multiplexed print nozzles are used to achieve production throughput of greater than >18,000 interconnects per hour, and high aspect ratio interconnects with 30µm line width and 6µm line heights have been demonstrated at sub 60µm pitches with low resistivity.

The presentation will also include pre-production qualification results, final production packaging, and further definition of the Aerosol Jet print platform integrated within a high throughput, manufacturing ready automation solution.

The IMAPS Device Packaging conference is being held March 8-10th at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, Arizona. The seventh Annual Device Packaging Conference is an international event and attracts a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. The conference provides a focused forum on the latest technological developments in five topical workshop areas related to microelectronic packaging, including 3D IC & Packaging, Flip Chip Technologies, MEMS & Associated Microsystems, Wafer Level Packaging; and Emerging Technologies (LEDs & Passive Integration).

Optomec provides additive manufacturing technologies for high-performance applications in the electronics, solar, medical, and aerospace & defense markets. Learn more at www.optomec.com

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