TeraView partners with HELIOS on THz semiconductor package failure analysis

March 15, 2011 — TeraView, provider of terahertz solutions and technology, is collaborating with the Hyperspectral Engine Lab for Integrated Optical Systems (HELIOS) in a Third-Frontier-supported project within the Electrical Engineering Department of Ohio State University (Columbus, OH). Headed by Professor J. Volakis, HELIOS aims help turn technology into commercial solutions–in this case, to improve semiconductor package failure analysis using terahertz technology.

As part of the collaboration TeraView has provided one of its Electro Optical Terahertz Pulsed Reflectometry (EOTPR) systems. These units were originally developed with Intel and are used for isolating faults in advanced 3D semiconductor packages. This is the first time the technology has been made available outside of Intel and it is hoped to use the unit to expose the technology to a wider North American semiconductor audience. The EOTPR system provides an alternative use of terahertz signals. Electrical pulses containing frequency components in the terahertz region are generated and able to propagate through interconnects in semiconductor packages allowing greatly improved fault isolation.

TeraView is investigating setting up a US office in the region, with the EOTPR system exposure to a Noth American audience, said Don Arnone, Teraview CEO.

A spin out from Toshiba and Cambridge University in 2001 and employing 25 staff, Teraview has been developing terahertz technology for medical imaging, electronics, defense and security, non-destructive testing, and pharmaceuticals. Learn more at www.teraview.com

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