Cu wire bonding joins MagnaChip Semiconductor offerings

April 5, 2011 – PRNewswire – MagnaChip Semiconductor Corporation (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, now offers cost-competitive and state-of-the-art copper wire bonding technology for semiconductor foundry customers. 

Copper bonding uses copper wires instead of gold for interconnection and has become one of the most preferred methods to reduce overall package cost for semiconductor applications, as the price of gold continues to rise.

Copper is three to five times less costly than gold. Substituting gold with copper can achieve a packaging cost savings of about 20% to 30%.  Copper wire is about 30% more conductive than gold, making it a superior electrical conductor. Copper also has about 25% higher thermal conductivity. Because of copper’s lower tendency to form intermetallic compounds, copper bonds can offer higher reliability at elevated temperatures than gold bonds.

One of the major challenges of copper wire bonding has been the significant mechanical stress imposed on bonding pads, which often resulted in damage to silicon wafers, causing cracks beneath the pads. To resolve this issue, MagnaChip worked with the major packaging companies, including Amkor, to develop and qualify an enhanced silicon bonding process.

MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer applications.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....